Samsung Galaxy S 4G PCB Board Components Layout

Here's the Samsung Galaxy S 4G PCB board which shows the components and IC's mounted or used in the circuit. The major IC's used were labeled as a reference and familiarization of the entire PCB board layout.

Samsung Galaxy S 4G front PCB Motherboard IC Components:

     Maxim MAX8987 DC Power Management
     Samsung KB100L00WM-A453 4Gb (512 MB) of mobile DRAM which contains a 1 GHz Intrinsity Processor in a package-on-package configuration, according to the fine folks at
     ST Ericsson's THOR M5730 HSPA+ Thin Modem
     ST Ericsson GNS7560 Single Chip GPS Solution
     Bosch Sensortec Accelerometer

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Samsung Galaxy S 4G Back PCB Motherboard IC Components:

     Broadcom BCM4329 802.11n Wi-Fi, Bluetooth 2.1, and FM Tuner
     ST Ericsson RF5000 Radio Transceiver (part of THOR M570 chipset)
     Wolfson Microelectronics WM8994 Audio CODEC
     Skyworks SKY77447 Load Insensitive Power Amplifier for WCDMA / HSDPA / HSUPA / HSPA+ Band II
     Skyworks SKY77544 TX-RX Front End Module
     Skyworks SKY77460 WCDMA/HSPA+ Power Amplifier

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The Samsung Galaxy S 4G compact front and rear  camera assembly flex board.

It uses a NEC MC10170 Image Processor cleverly mounted right to its ribbon cable.


The Samsung Galaxy S 4G headphone jack, earpiece speaker, and proximity/ambient light sensors Flex cable.

Back of the display assembly mounted the Atmel mXT 224 touchscreen controller.

The removed button capacitive touch sensors, vibrator unit, lower microphone, and antenna cable connector mounted on the same flex assembly.

There you have it the labeled Samsung Galaxy S 4G PCB Board, That's all folks!

 Credit to: advancegsm.blogspot.com